Driven by the “Next AI” wave at COMPUTEX 2026, AI is rapidly evolving from cloud computing toward edge devices. At this year’s exhibition, 3S will showcase next-generation technology applications spanning audio, ultrasound, audio interfaces, AI recognition, and storage solutions, further advancing intelligent sensing technologies while aligning with the accelerating adoption of AI applications. The company focuses on key application markets including smart devices, automotive electronics, robotics, edge AI, and data storage, demonstrating the scalability and commercial value of its technologies in real-world applications.

This year’s showcase includes:

• Next-Gen MEMS Mic:The company specializes in developing highly consistent acoustic sensing cores to further enhance voice recognition, environmental acoustic analysis, and ultrasonic signal reception capabilities. Its latest ultrasonic ranging applications can extend spatial sensing capabilities, enabling enhanced short-range environmental detection and spatial interaction applications.
• Edge AI Applications:The company will demonstrate an access control management system developed with Edge AI facial recognition technology. Featuring offline operation capability, low deployment cost, and enhanced data privacy protection, the system ensures personal data remains secure and local. In addition, the company has developed offline AI automatic speech recognition (ASR) models supporting both Mandarin and Taiwanese languages. Moving forward, the company plans to further integrate AI vision recognition and AI speech recognition technologies to develop diversified products for various application scenarios.
• Storage Array Solution and Flash Controller:The company launches expandable enterprise storage array solution. It includes PCIe Gen4 x 8 HBA Card with SAS Expander which can link SAS or SATA HDD or SSD smoothly, provides high capacity, high reliability storage solution and the expandable solution and the flexibility and convenience of modularization. On the other hand, we also launch USB 3.2 Gen I LDPC controller, and it could support Type A/C USB flash disk and the newest generation QLC NANDs.       
• USB multimedia audio:USB audio controller has Line-in, Microphone-in, headphone output, and speaker output interface, and offers a variety of control signal interfaces such as I2C, I2S, GPIO which can be gone with the different MCU or DSP core, to provide sufficient and flexible design space for system companies.

Solid State System Co., Ltd. new product showcase will be held during COMPUTEX 2026 from June 2^nd to June 5^th at Taipei World Trade Center Hall 1, AI Robotics Zone, Booth No. A1115a. We sincerely invite industry professionals to visit our booth for exchange and discussion.