How Will AI Transform the Future of Acoustics? 3S’s Next-Gen MEMS Mic Debuts at COMPUTEX 2025! | 2025-04-30 |
As AI technology advances at an unprecedented pace, sound sensing is on the verge of a revolutionary breakthrough. This year, COMPUTEX 2025’s Next AI is redefining computing and perception—ushering in a new era for acoustic technology. But what difference can the integration of AI and MEMS microphones make for smart acoustics? How can devices go beyond just hearing human voices and executing commands—toward detecting sounds from the body and the environment? The answers await you!
With over 30 years of expertise in acoustics, Solid State System Co., Ltd. (3S) continues to lead the industry with MEMS microphone technology that offers the highest level of consistency in the market. Our Next-Gen MEMS Mic, featuring proprietary MEMS sensors and ASIC chips, ensures superior signal-to-noise ratio, frequency response, and phase accuracy—pushing intelligent acoustics to the next level.
At this exhibition, we will also be jointly showcasing next-gen in-vehicle ADAS applications with onsemi, collaborating to create smarter and safer automotive acoustic sensing solutions that demonstrate the profound impact of AI technology in real-world applications.
Visit 3S booth at COMPUTEX 2025 and discover the limitless possibilities of AI in acoustics! Solid State System Co., Ltd. will exhibit the above new products and solutions at booth L1331 on the 4F, System Integration Solution area in Taipei Nangang Exhibition Hall 1, 2025 COMPUTEX TAIPEI from May 20th to May 23th, 2025. Welcome to our booth! ![]() |